Technology Development Manager / Senior Manager

onsemi is seeking a highly motivated Technology Development Manager or Senior Manager to lead the development, qualification, and high-volume manufacturing ramp of Embedded Power Module technologies at our East Fishkill, NY 300mm wafer fab.

This role is a critical leadership position within the Technology Development organization, with end-to-end accountability for developing onsemis advanced Embedded Power Module process and packaging concepts into qualified, manufacturable, and competitive products aligned with onsemis long-term technology and business roadmaps.

The successful candidate will lead a team of experienced development engineers and will serve as a key technical and organizational interface across Business Units, Product Engineering, Manufacturing, Operations, Packaging, Reliability, Finance, external partners, and executive leadership.

People & Organization Leadership

Manage and develop a team of approximately 515 engineers.

Build a high-performance engineering culture and support talent development and succession planning.

Technical & Technology Ownership

Serve as overall technical leader for Embedded Power Module technology development, qualification, and ramp.

Own technical readiness across process integration, yield, reliability, and manufacturability.

Program Execution & Delivery

Lead and deliver multiple concurrent technology development programs aligned with global corporate technology development and manufacturing requirements.

Partner with program and product management to transition technologies into high-volume production.

Cross-Functional & Executive Engagement

Act as primary interface with internal stakeholders and external partners.

Communicate technical and program status to senior and executive leadership.

QUALIFICATIONS

M.S. degree or higher in engineering (PhD preferred).

Extensive semiconductor industry experience (typically 15+ years).

Strong leadership, communication, and cross-functional collaboration skills.

Preferred

Deep knowledge of power modules, ICs, advanced packaging, and backend processing.

Experience with Cu plate-up, RDL via etch, encapsulation, pick-and-place, sinter attach, and HV testing is desired.

Salary: onsemi is excited to share the base salary range for this position is $147.000 to $250,000 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of the internal equity of our current team members. We also offer a competitive benefits package.